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| Job details |
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| PACKAGING ENGINEER |
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| Description |
SENIOR TECHNOLOGY PACKAGING TECHNOLOGY ENGINEER #1231824
Lead next generation 28nm Lead Free bump and assembly technology development with our foundry and subcon partners. The engineer will be responsible for defining process flow, material set, design rules and fab/bump/assembly process controls needed to successfully develop a manufacturable and reliable Lead Free product.
MINIMUM REQUIREMENTS:
- Phd - Materials Science, Mechanical Engineering, Physics.
- 5+ Years in technology development.
- Expert in Bump/Packaging/Assembly.
- Must have experience in Lead Free FC Development & Chip-Package Interaction.
- Materials expertise in bump material, substrates, and UF.
EOE |
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